发明名称 Apparatus for supplying epoxy molding compound
摘要 <p>PURPOSE: A device for supplying an epoxy molding compound is provided to prevent a large amount of EMC powders from being abnormally thrown down by arranging a gate member inside a trench member. CONSTITUTION: A container(102) stores an epoxy molding compound which is a powdered state. A trench member(104) transports the epoxy molding compound. A vibration generator(110) transfers the epoxy molding compound from the container towards the end part of the trench member. The vibration generator vibrates the container and the trench member. A gate member(106) is arranged within the trench member in order to control the amount of the epoxy molding compound.</p>
申请公布号 KR101038732(B1) 申请公布日期 2011.06.03
申请号 KR20080129570 申请日期 2008.12.18
申请人 发明人
分类号 H01L21/56;H01L23/28 主分类号 H01L21/56
代理机构 代理人
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