发明名称 POLYMER THERMAL INTERFACE MATERIALS
摘要 <p>In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.</p>
申请公布号 KR20110059748(A) 申请公布日期 2011.06.03
申请号 KR20117007593 申请日期 2009.12.09
申请人 INTEL CORPORATION 发明人 LI YI;PRACK ED
分类号 C09K5/06;C08K7/16;C08K9/04;H05K7/20 主分类号 C09K5/06
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