发明名称 |
FLEXIBLE COPPER-CLAD LAMINATE |
摘要 |
In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni-Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni-Zn alloy is 6% or more and 15% or less of the (Ni deposition amount + Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm 2 or more to provide a flexible cupper clad laminate. |
申请公布号 |
KR20110059705(A) |
申请公布日期 |
2011.06.03 |
申请号 |
KR20117004001 |
申请日期 |
2009.07.22 |
申请人 |
FURUKAWA ELECTRIC CO., LTD.;NIPPON STEEL CHEMICAL CO., LTD. |
发明人 |
FUJISAWA SATOSHI;SUZUKI YUJI;UNO TAKEO;HATTORI KOICHI;KUWASAKI NAOYA |
分类号 |
B32B15/08;B32B15/088;C25D7/06;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|