发明名称 SYSTEMS, METHODS, AND DEVICES FOR SEALING LED LIGHT SOURCES IN A LIGHT MODULE
摘要 A light module includes one or more LEDs coupled to a circuit board, a lens disposed over at least one LED, and an adhesive layer disposed between each LED and the lens. A flange extends from at least one side of the lens. The adhesive layer fixes the lens in an optical alignment over the corresponding LED. The adhesive layer includes at least one of a non-permeable layer with an adhesive material on the top and bottom surfaces, a gas-permeable layer with an adhesive material on the top and bottom surfaces, a deposited material, and an over mold material. An alignment tool including one or more optical recesses and one or more alignment features is used in the assembly of at least one of an optical assembly and a light module that includes the optical assembly. The alignment tool facilitates precise alignment of the lenses over the LEDs.
申请公布号 WO2011066421(A2) 申请公布日期 2011.06.03
申请号 WO2010US58048 申请日期 2010.11.24
申请人 COOPER TECHNOLOGIES COMPANY;DAVIS, MATTHEW, A.;BRADFORD, REED, ALAN;PATRICK, ELLIS 发明人 DAVIS, MATTHEW, A.;BRADFORD, REED, ALAN;PATRICK, ELLIS
分类号 F21V17/00;F21S2/00;F21V13/00 主分类号 F21V17/00
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