| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the occurrence of separation of a film and formation of leak path in a semiconductor device that includes an interlayer insulating film. <P>SOLUTION: The semiconductor device includes the interlayer insulating film 16 that has multiple holes. The interlayer insulating film 16 is a film having a single layer structure. In the interlayer insulating film 16, the diameters of the holes included in a lower surface region and in an upper surface region are smaller than those of the holes included in the center region between the upper region and lower region. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
