| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in a conventional rigid and flexible substrate that stress is likely to be concentrated on wiring near bending parts, so the finer or the thinner the wiring is, the more likely reliability is affected at bending. SOLUTION: A notched part 112 is provided on film base materials 107 comprising a flexible part 103 of the rigid and flexible substrate 101. The notched part 112 is filled with part of a first adhesion layer 108 or second adhesion layer 110, thereby considerably enhancing bending reliability when the wiring 109 is made finer or thinner. COPYRIGHT: (C)2011,JPO&INPIT
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