| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive supply device capable of stably supplying flux to all the connection pads even when the heights of the arranged connection pads of a substrate vary, and also facilitating a connection pad with a narrow pitch. <P>SOLUTION: The device includes a silicon substrate 10, a silicon transfer pin 12 provided on the undersurface side of the silicon substrate 10 so as to protrude therefrom, and an elastic resin layer 14 provided at the root or tip end of the silicon transfer pin 12 so as to contract in the vertical direction. Preferably, the elastic resin layer may be aranged at the root or tip end of a silicon nozzle of the adhesive supply device using a dispensing system. <P>COPYRIGHT: (C)2011,JPO&INPIT |
