| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an urethane resin suitable for forming a flexible coating film having excellent adhesiveness with a base material, folding resistance, low warpage, solder heat resistance and the like; a thermosetting resin composition containing the urethane resin; and a printed wiring board and the like wherein a protective film or an insulating layer is formed of a cured product of the thermosetting resin composition. <P>SOLUTION: The urethane resin is obtained by reacting (a) a polyisocyanate, (b) a compound containing two or more alcoholic hydroxy groups, and (c) a compound containing one alcoholic hydroxy group and one or more phenolic hydroxy groups in one molecule. The component (b) comprises at least one compound selected from the group consisting of a polycarbonate diol containing repeating units derived from one or more kinds of linear aliphatic diols as structural units, a polycarbonate diol containing repeating units derived from one or more kinds of alicyclic diols as structural units, and a compound having a phenolic hydroxy group and two or more alcoholic hydroxy groups. <P>COPYRIGHT: (C)2011,JPO&INPIT |
