| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an ultra-thin-film integrated circuit, an IC chip including the thin-film integrated circuit, and the like, because an IC chip made of a silicon wafer is thick, so that when it is mounted on a commodity container itself, the surface thereof becomes uneven, degrading the designability. <P>SOLUTION: The IC chip including a thin-film integrated circuit, unlike an integrated circuit formed from a conventional silicon wafer, has a semiconductor film as an active region (for example a channel region in a thin-film transistor). The IC chip as above is very thin, so that the deseignability is not impaired even if it is mounted on a commodity such as a card or a container. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
