SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To reduce regions where wiring and semiconductor elements, or the like are not freely arranged. SOLUTION: A semiconductor device includes: a semiconductor substrate 1 with a first surface in which semiconductor elements 3 are formed and a second surface opposite to the first surface; an interlayer insulation film that is formed on the semiconductor substrate and has a first via 7; and a second via 13 that is formed on the semiconductor substrate 1 and a second via 13 connected with the first via 7. The diameter of the first via 7 is smaller than that of the second via. COPYRIGHT: (C)2011,JPO&INPIT