| 摘要 |
PROBLEM TO BE SOLVED: To provide a barrel plating device in which the occurrence of the variation of plating thickness is prevented by grasping the current flowing in respective cathode rods. SOLUTION: The barrel plating apparatus includes: a barrel plating tank filled with an electrolytic solution; a barrel container immersed in the electrolytic solution of the barrel plating tank and filled with chip parts and media; a power supply unit for supplying current to an anode part and a cathode part which transfer the current to the barrel container and the electrolytic solution of the barrel plating tank; a driving motor for rotating the barrel container; and a hall current sensor formed inside the cathode rod of the cathode part, which comes into direct contact with the chip parts and measuring the current. The currents of respective cathode rods are measured by hall current sensors, and thus variations in plating thickness can be reduced. COPYRIGHT: (C)2011,JPO&INPIT
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