| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg which excels in adhesiveness and circuit embedding property while restraining flow of resin and prevents the generation of dust when it is processed, and is also excellent in yield, and to provide printed wiring boards. SOLUTION: The prepreg is obtained by impregnating a fibrous base material with a varnish containing an epoxy resin composition and drying the resulting base material. The epoxy resin composition contains, as essential components, (A) an epoxy resin (except (B) the urethane-modified epoxy resin), (B) the urethane-modified epoxy resin, (C) an epoxy resin curing agent, and (D) a curing accelerator, wherein the total amount of the components (A) to (D) is 100 pts.mass, and the blending amount of the component (B) is 15-90 pts.mass in the total amount of the components (A) to (D). Multilayer printed wiring boards and flexible printed wiring boards each using the prepreg are also provided. COPYRIGHT: (C)2011,JPO&INPIT |
