发明名称 CLEANING LIQUID FOR LITHOGRAPHY AND METHOD FOR FORMING WIRING
摘要 Provided are a cleaning liquid for lithography that exhibits excellent corrosion suppression performance in relation to tungsten, and excellent removal performance in relation to a resist film or the like, and a method for forming a wiring using the cleaning liquid for lithography. The cleaning liquid for lithography according to the present invention includes a quaternary ammonium hydroxide, a water-soluble organic solvent, water, an inorganic salt and an anti-corrosion agent represented by a general formula (1) below. In the general formula (1), R1 represents an alkyl group or an aryl group having 1-17 carbon atoms, and R2 represents an alkyl group having 1-13 carbon atoms.
申请公布号 US2011129998(A1) 申请公布日期 2011.06.02
申请号 US20100958295 申请日期 2010.12.01
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 ETO TAKAHIRO;OHHASHI TAKUYA;TAKAHAMA MASARU;MORI DAIJIRO;KUMAZAWA AKIRA
分类号 H01L21/283;G03F7/42 主分类号 H01L21/283
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