| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing possibility that a circuit may be short-circuited by a die-bonding material crawled up on the external surface of a coating member. <P>SOLUTION: The semiconductor device includes: a semiconductor chip part 10 having a plate-like semiconductor substrate 10A; a coating member 20 having a bottom part 21 which coats an undersurface 12 opposite to a main surface 11 to which a die-bonding material B containing a metal is connected and on which a circuit is formed on the semiconductor substrate 10A in the plate thickness direction of the semiconductor substrate 10A and a side wall part 22 which is erected in a direction from the undersurface 12 to the main surface 11 in the plate thickness direction of the semiconductor substrate 10A to coat the side surface 13 of the semiconductor substrate 10A; and a dielectric part 30 which is formed on an upper end surface 22B turned in a direction from the undersurface 12 of the semiconductor substrate 10A to the main surface 11 and an outside surface 22A of the side wall part 22. <P>COPYRIGHT: (C)2011,JPO&INPIT |
