| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package which reduces the assembly cost sharply by reducing the constituent members and the number of assembly steps, can make thin the semiconductor package, and can attain the thickness of 1 mm or less even in case of a 10-tiered POP structure. <P>SOLUTION: The semiconductor package can be made thin by eliminating the need for the constituent members of a conventional semiconductor package, i.e. a lead frame, a substrate and a wire, and the adhesive. <P>COPYRIGHT: (C)2011,JPO&INPIT |
