| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable wiring board whose possibility of wire fracture is much more reduced even if a thermal stress is generated between an insulating resin layer and a ceramic wiring board. <P>SOLUTION: The wiring board is constructed such that a plurality of insulating resin layers 2 and a plurality of wiring layers 3 are alternately laminated on the upper surface of the ceramic wiring board 1, a via conductor 4 connects wiring layers 3, 3 disposed on the upper and lower sides of an insulating resin layer 2, a plurality of via conductors 4 formed in the lowest layer of the insulating resin layers 2 and ends of a plurality of internal wires 5 drawn out from the inside to the upper surface of the ceramic wiring board 1 are electrically connected respectively, and a periphery of the connection portion of the ends of the via conductor 4 and the internal wires 5 is covered with a fixing material 9 having Young's modulus higher than that of an insulating resin of the insulating resin layer 2. The periphery of the connection portion of the ends of the via conductors 4 and the internal wire 5, the connection portion having relatively weak connection strength, is fixed with the fixing material 9 and is difficult to deform, thereby achieving a highly reliable wiring board in which the possibility of wire fracture at the connection portion is reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
