PRESSURE SENSOR MODULE AND THE PACKAGING METHOD USING THE SEMICONDUCTOR STRAIN GAGE

摘要

PURPOSE: A semiconductor strain gauge type pressure sensor module and a manufacturing method thereof are provided to prevent inflow of foreign materials by wire connection. CONSTITUTION: A manufacturing method of a semiconductor strain gauge type pressure sensor module is as follows. A pressure sensor hole(210) is constituted in a diaphragm(200). A semiconductor type strain gage(300) having first conductive pad(310) is prepared. The insulating material with cohesive property spreads on the side opposing of the pressure sensor hole of diaphragm. A strain gage is attached to a surface covered with an insulating material. A solder bumper is formed on the first conductive pad. The first conductive pad of a semiconductor type strain gauge and the second conductive pad of a circuit board are fused each other by using flip chip mounting technique.