| 摘要 |
PROBLEM TO BE SOLVED: To prevent a state, i.e. an open state, wherein connection resistance becomes infinite owing to an increase in ESR or a defect in electrical connection between a cathode layer and an internal cathode terminal 9 as cracking or peeling due to the warpage of the conversion substrate, caused by thermal stress occuring at a connection interface in the presence of stressing by thermal stress of resin or external direct stress. SOLUTION: A chip-type solid electrolytic capacitor uses a cathode conductive adhesive 7, having a scratching hardness of 2B to 6B (in a pencil method) after a conductive adhesive is cured. COPYRIGHT: (C)2011,JPO&INPIT |
