| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board connected body reducing manufacturing cost of the wiring board connected body by adopting a wiring board of low heat resistance, and to provide a wiring body used therein. SOLUTION: The method includes a first adhesive layer forming step of forming a first adhesive layer 103 containing one of a thermosetting resin and a curing agent in a connection area including the first electrode of a first wiring board 8, a second adhesive layer forming step of forming a second adhesive layer 102 including the other of the thermosetting resin and the curing agent in a connection area including second electrodes 11b, 12b of a second wiring board 10, a positioning step of positioning the first wiring board and second wiring board by bringing the first electrode into opposition to the second electrode and bringing the first adhesive layer into face contact with the second adhesive layer, and a connecting step of pinching the first adhesive layer and second adhesive layer between the first wiring board and second wiring board to react the thermosetting resin with the curing agent to electrically conduct the first electrode to the second electrode and bonding together the first wiring board and second wiring board at a predetermined temperature. COPYRIGHT: (C)2011,JPO&INPIT
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