| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit pattern defect inspection method of substrate capable of reducing the risk of wrong measurements and reducing the measurement time. SOLUTION: A laser irradiation part 101 for irradiating an inspection object circuit pattern 106 on the substrate 105 with laser 103 in the noncontact state is prepared, and a probe beam irradiating unit 102 for irradiating a connected circuit pattern 107 to be connected electrically to the inspection object circuit pattern 106 with a probe beam 104 in the noncontact state is prepared. Then, the inspection object circuit pattern 106 is irradiated with the laser 103 from the laser irradiating unit 101, and the connected circuit pattern 107 is irradiated with the probe beam 104 from the probe beam irradiating unit 102, to measure the occurrence of diffraction and the diffraction angle of the probe beam 104. COPYRIGHT: (C)2011,JPO&INPIT
|
