发明名称 |
SUBSTRATE INSPECTION APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus capable of minimizing contact points, using a 4-terminal measuring system. SOLUTION: The substrate inspection device 100 includes a current supply unit 110 for supplying a current to a first current supply wire 112a and a second current supply wire 112b; a voltage-measuring unit 120 for measuring the voltage between a first voltage measuring wire 122a and the second voltage-measuring wire 122b; a first connection electrode unit 130a connected electrically to the first current supply wire 112a and the first voltage-measuring wire 122a; a second connection electrode unit 130b electrically connected to the second current supply wire 112b and the second voltage-measuring wire 122b; a first contact probe 140a electrically connected to the first connection electrode unit 130a, and having a contact with one side of a wiring pattern; and a second contact probe 140b electrically connected to the second connection electrode unit 130b, and making a contact with the other side of the wiring pattern. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011107115(A) |
申请公布日期 |
2011.06.02 |
申请号 |
JP20090294990 |
申请日期 |
2009.12.25 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM HYUN JOON;LEE JIN HWAN;KWAK BYUNG HEON;JUNG BYUNG WUL |
分类号 |
G01R31/02;G01R1/067;H05K3/00 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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