发明名称 SUBSTRATE INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus capable of minimizing contact points, using a 4-terminal measuring system. SOLUTION: The substrate inspection device 100 includes a current supply unit 110 for supplying a current to a first current supply wire 112a and a second current supply wire 112b; a voltage-measuring unit 120 for measuring the voltage between a first voltage measuring wire 122a and the second voltage-measuring wire 122b; a first connection electrode unit 130a connected electrically to the first current supply wire 112a and the first voltage-measuring wire 122a; a second connection electrode unit 130b electrically connected to the second current supply wire 112b and the second voltage-measuring wire 122b; a first contact probe 140a electrically connected to the first connection electrode unit 130a, and having a contact with one side of a wiring pattern; and a second contact probe 140b electrically connected to the second connection electrode unit 130b, and making a contact with the other side of the wiring pattern. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011107115(A) 申请公布日期 2011.06.02
申请号 JP20090294990 申请日期 2009.12.25
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM HYUN JOON;LEE JIN HWAN;KWAK BYUNG HEON;JUNG BYUNG WUL
分类号 G01R31/02;G01R1/067;H05K3/00 主分类号 G01R31/02
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