发明名称 MEMS Microphone Packaging and MEMS Microphone Module
摘要 A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is opposite to the first surface. Furthermore, a cap is arranging on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure. A readout device for the MEMS microphone structure is arranged on a first surface of a second substrate which further includes a second surface, which is opposite to the first surface. The second surface of the first substrate is attached to the second surface of the second substrate.
申请公布号 US2011127623(A1) 申请公布日期 2011.06.02
申请号 US20090627833 申请日期 2009.11.30
申请人 发明人 FUELDNER MARC;WURZER MARTIN;DEHE ALFONS
分类号 H01L29/84;H01L21/50 主分类号 H01L29/84
代理机构 代理人
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