COMPOSITION FOR ETCHING COPPER AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

PURPOSE: A composite for etching copper is provided to reduce a defect by removing impurities remaining on the cut part of a fuse line. CONSTITUTION: A fuse line with copper is prepared on a semiconductor substrate(S10). A fuse line is cut by irradiating a laser beam to the fuse line(S50). Copper and copper oxide remaining on the cut part of the fuse line are removed by applying the composite for etching copper to the semiconductor substrate. The cut part of the fuse line is minutely etched(S60). The composite for etching copper includes organic acid of 0.01 to 10 weight%, oxidizer of 0.01 to 1 weight%, and protic solvent.