WAFER AND METHOD FOR MANUFACTURING THEREOF

摘要

PURPOSE: A wafer and forming method thereof are provided to dice each RFID chip on a wafer with RFID chips using a DRIE(Deep Reactive Ion Etching) process, thereby reducing processing costs and processing time. CONSTITUTION: A wafer ring frame is formed on a semiconductor substrate(100). The wafer ring frame is made of a ring mount(107) and a ring film(106). The ring mount supporting the ring film is formed on the outer periphery of the ring film. A trench(103) contacts the ring film. A coating film is formed on a passivation layer(101) and a trench area(102).