HEAT SINK FOR PRESS PACKAGE, AND STACK FOR COOLING AND PACKAGING

摘要

PROBLEM TO BE SOLVED: To provide a heat sink for directly cooling one or more electronic element packages.

SOLUTION: The electronic element package has an upper contact surface 22 and a lower contact surface 24. The heat sink includes a cooling member 310, made of one or more kinds of thermally conductive materials. The cooling member defines a plurality of entrance manifolds configured to receive a coolant and a plurality of exit manifolds configured to discharge the coolant. The entrance manifolds and exit manifolds are arranged alternately. The cooling member further defines a plurality of milli-channels configured to receive the coolant from the entrance manifolds and feed it to the exit manifolds. The cooling member further has a configuration in which the milli-channels, and entrance and exit manifolds are brought into direct contact with the coolant to directly cool the upper and lower contact surfaces of the electronic element package. Hence, the heat sink is formed into an integrated type heat sink.

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