| 摘要 |
PROBLEM TO BE SOLVED: To provide a stacking apparatus capable of solving the problem that high-speed alignment with the accuracy of sub-micron becomes difficult on the entire surface of wafers to be stacked because wafer size tends to be larger and larger in recent years, and more specifically, correctly moving a certain wafer to another wafer at a high speed in accordance with an alignment command. SOLUTION: The stacking apparatus for aligning and stacking a plurality of substrates includes: a first stage for holding a first substrate; a second stage for holding a second substrate positioned so as to face the first substrate; a third stage movable in a direction orthogonal to the facing direction; a supporting mechanism for supporting the second stage in a gravity direction; and a thrust force transmitting portion provided between the third stage and the supporting mechanism so that the second stage and the supporting mechanism can integrally move so as to contactlessly follow the movement of the third stage. COPYRIGHT: (C)2011,JPO&INPIT |
