发明名称 TERMINAL STRUCTURE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a terminal having a conductor passing through a set prepreg, and also a method of manufacturing an electronic device having the terminal. <P>SOLUTION: A prepreg has at least one opening. The prepreg is bonded on a substrate having an electronic element formed thereon so that a conductor forming a terminal is overlapped with the opening of the prepreg. Conductive paste is provided in a region of the prepreg where the opening is formed. The conductive paste partly flows into the opening, whereby the terminal is connected to the conductor. Then the resultant substrate is subjected to heating treatment to set the conductive paste and the prepreg. In the course of forming the terminal, the need of carrying out a step of forming the opening with a laser beam after the prepreg is set can be eliminated. Thus, the influence of the laser beam on the electronic element can be eliminated. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011109077(A) 申请公布日期 2011.06.02
申请号 JP20100232208 申请日期 2010.10.15
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 HAMAYA TOSHIJI;AOKI TOMOYUKI;ADACHI HIROKI;YAJIMA HIROYUKI
分类号 H05K3/46;H05K1/11;H05K3/40 主分类号 H05K3/46
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