| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling apparatus for a semiconductor element, having structure that enables a rise in the manufacturing cost of the cooling apparatus for the semiconductor element to be suppressed. SOLUTION: The cooling apparatus for the semiconductor element includes: a first member 21 whose one surface has a mount 2A on which a semiconductor element is mounted, and whose other surface 20B has a plurality of fins 4 that define a plurality of coolant flow paths 20, and that extend in a first direction DR1, and that stand from the other surface 20B to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member 22 that defines the plurality of coolant flow paths 20 that extend in the first direction DR1 by closing gaps between the plurality of fins 4 from the height-direction distal end side of the fins 4. The fins 4 have grooves 4h which extend in a second direction DR2 intersecting the first direction DR1 and extend from the height-direction distal end side of the fins 4 toward the other surface 20B. The depth d of the grooves 4h is smaller than the height H of the fins 4. A protrusion-forming member 32 is disposed in the grooves 4h, extends across adjacent fins 4, and forms protrusions in the coolant flow paths 20 defined by the adjacent fins 4. COPYRIGHT: (C)2011,JPO&INPIT |
