发明名称 LAMINATED MOUNTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a laminated mounting structure which enables reduction in the size while increasing the flexibility of designing. SOLUTION: In the laminated mounting structure 1 of an embodiment, a first member 10 includes a first connecting electrode 13 among members which is disposed in an end surface constituting a prescribed connecting side surface among members of the laminated mounting structure 1. A second member 20 also includes a second connecting electrode 23 among members which is disposed in an end surface constituting a connecting side surface among members. Then, a conductive film 40 which crosses over an opposing part between the first member 10 and the second member 20 and electrically connects the first and second electrodes 13, 23 among members mutually is placed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011103931(A) 申请公布日期 2011.06.02
申请号 JP20090259165 申请日期 2009.11.12
申请人 OLYMPUS CORP 发明人 SEKIDO TAKANORI
分类号 A61B1/04;G02B23/24 主分类号 A61B1/04
代理机构 代理人
主权项
地址