发明名称 |
DIRECT OXIDATION METHOD FOR SEMICONDUCTOR PROCESS |
摘要 |
An oxidation method for performing direct oxidation includes respectively supplying an oxidizing gas and a deoxidizing gas to the process field, and directly oxidizing a surface target substrates by use of oxygen radicals and hydroxyl group radicals generated by a reaction between the oxidizing gas and the deoxidizing gas. The oxidizing gas is supplied through an oxidizing gas nozzle extending over a vertical length corresponding to the process field and is spouted from a plurality of gas spouting holes formed on the oxidizing gas nozzle and arrayed over the vertical length corresponding to the process field. The deoxidizing gas is supplied through a plurality of deoxidizing gas nozzles having different heights respectively corresponding to a plurality of zones of the process field arrayed vertically and is spouted from gas spouting holes respectively formed on the deoxidizing gas nozzles each at height of a corresponding zone.
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申请公布号 |
US2011129604(A1) |
申请公布日期 |
2011.06.02 |
申请号 |
US201113025738 |
申请日期 |
2011.02.11 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
INOUE HISASHI;TOIYA MASATAKA;MIZUNO YOSHIKATSU |
分类号 |
C23C16/448;C23C16/00;C23C16/22 |
主分类号 |
C23C16/448 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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