Substitutional electroless gold plating solution and method for forming gold plating layer using the same

摘要

There is provided a substitutional electroless gold plating solution and a method for forming a gold plating layer using the same. The substitutional electroless gold plating solution includes an organic solvent, and an organic acid-based gold salt dissociated from the organic solvent to generate gold ions. The substitutional electroless gold plating solution can form a gold plating layer having a uniform thickness and enhance bonding strength with a base metal. Further, the substitutional electroless gold plating solution can form a gold plating layer using various printing methods.