Package for an implantable neural stimulation device

摘要

An implantable device, comprising a rigid substrate having an electrically non-conductive portion; a plurality of electrically conductive vias through said electrically non-conductive portion, said vias and electrically non-conductive portion forming said rigid substrate; metal traces on said rigid substrate electrically connected to said conductive vias; a circuit attached to said metal traces; a braze stop trace surrounding said metal traces; a cover bonded to said rigid substrate with a braze, said cover and said rigid substrate forming a hermetic package; wherein said braze stop trace prevents said braze from contacting said metal traces.