| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition that is used for forming films having a thickness of 30 μm or more, where such films are highly transparent, have a low permittivity (permittivity lower than or equal to that of a thermal silicon oxide film), and have high heat resistance (heat resistance sufficient to withstand subsequent processing). <P>SOLUTION: The resin composition is a polymer composition for forming a negative-tone self-imageable film, that includes a norbornene-based polymer, a photoacid generator and a solvent. <P>COPYRIGHT: (C)2011,JPO&INPIT |
