| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a downsized package for sealing micro-electromechanical systems (MEMS). <P>SOLUTION: The Micro-ElectroMechanical Systems (MEMS) 30 are sealed by being sandwiched by a first glass plate 24 and a second glass plate 26. Electrical connections 34, 36 are available at an edge of the MEMS and connected to bumps 42-1, 42-2 provided on a side face of the glass plate. The first glass plate 24 and the second glass plate 26 are sealed by a seal 32. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
