发明名称 FOAMED RESIN PANEL
摘要 PROBLEM TO BE SOLVED: To provide a foamed resin panel excellent in heat insulation efficiency. SOLUTION: At the point of time when starting to produce a skin layer 23 in the vicinity of a mold-molded surface of a thermoplastic resin R injected and filled from a gate 103a into the cavity 107 of a molding mold 101, a cavity volume is expanded to foam the thermoplastic resin R, thereby, such a duct constitution panel 11 that a skin layer 23 made of a solid layer which has a high resin density and is hard is formed over the whole surface to constitute a hermetically sealed space 27 on the inner part and, at the same time, a foamed layer 25 which has a number of voids and has a resin density lower than that of the skin layer 23 is integrally hermetically sealed in the hermetically sealed space 27 is provided. A gate remaining solidified material r1 which remains in the gate 103a and is solidified is cut off. In the periphery of a cut-off trace r2 of the gate remaining solidified material r1, a thick skin layer 23a which has the high resin density and is hard is disposed so that the hermetically sealed space 27 is intercepted from the open air. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011104958(A) 申请公布日期 2011.06.02
申请号 JP20090265326 申请日期 2009.11.20
申请人 DAIKYONISHIKAWA CORP 发明人 NIIMI SHINGO
分类号 B29C45/00;B29C45/26;B29C45/56;B29K105/04 主分类号 B29C45/00
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