发明名称 MEMS INTEGRATED CHIP AND METHOD FOR MAKING SAME
摘要 The present invention discloses a MEMS (Micro-Electro-Mechanical System) chip and a method for making the MEMS chip. The MEMS chip comprises: a first substrate having a first surface and a second surface opposing each other; a microelectronic device area on the first surface; a first MEMS device area on the second surface; and a conductive interconnection structure electrically connecting the microelectronic device area and the first MEMS device area.
申请公布号 US2011127620(A1) 申请公布日期 2011.06.02
申请号 US20090627480 申请日期 2009.11.30
申请人 PIXART IMAGING INCORPORATION, R.O.C. 发明人 WANG CHUAN-WEI;LEE SHENG-TA;HSU HSIN-HUI;WANG WEI-CHUNG
分类号 H01L29/84;H01L21/50 主分类号 H01L29/84
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