发明名称 |
Heat Spreader Structures in Scribe Lines |
摘要 |
An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.
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申请公布号 |
US2011127648(A1) |
申请公布日期 |
2011.06.02 |
申请号 |
US201113023151 |
申请日期 |
2011.02.08 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN HSIEN-WEI;LIU YU-WEN;SHEU JYH-CHERNG;TSAI HAO-YI;JENG SHIN-PUU;YU CHEN-HUA;HOU SHANG-YUN |
分类号 |
H01L23/544;H01L23/34 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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