发明名称 |
Lead pin for semiconductor package and semiconductor package |
摘要 |
Disclosed is a lead pin for a semiconductor package. The lead pin includes a coupling pin inserted into a hole formed in an external device, a head portion disposed at one end of the coupling pin, and a step portion formed in a stepped manner between the coupling pin and the head portion, the step portion having a smaller size than the head portion.
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申请公布号 |
US2011127676(A1) |
申请公布日期 |
2011.06.02 |
申请号 |
US20100805295 |
申请日期 |
2010.07.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI JIN WON;MOON SEUNG JEAN;LEE KI TAEK |
分类号 |
H01L23/48;H01B5/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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