| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical coupling device that reduces inspection cost, while reducing restrictions on mounting volume and mounting structure thereof. SOLUTION: An element having completed a wafer stage is subjected to wafer stage inspection. In a wafer 121 having a plurality of optical integrated circuit chips formed therein, a light input/output end of an optical fiber 108 is provided close to an optical integrated circuit chip 122 to be inspected, and an optical signal 151 guided in an optical waveguide comprising an optical waveguide part core 144, from the inside of the optical integrated circuit chip 122 is reflected by a grating coupler comprising a diffraction grating part 143 to be optically coupled with the optical fiber 108. Characteristics of an optical IC in the optical integrated circuit chip 122 can be inspected using signal light optically coupled with the optical fiber 108 in this manner. In addition, the optical IC part is driven by an electric signal supplied from a probe for power supply when necessary. COPYRIGHT: (C)2011,JPO&INPIT |
