| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a transistor and an electronic component such that heat that the transistor generates can be dissipated and the electronic component can be made compact. SOLUTION: First and second MOSFETs 11 and 12 constituting an H-type bridge driving circuit are mounted on a mounting portion B1a of a common first power supply output bus bar B1, and third and fourth MOSFETs 13 and 14 constituting an H-type bridge driving circuit are mounted on a mounting portion B2a of a common second power supply output bus bar B2. Consequently, the heat that the transistor generates can be dissipated, and the electronic component can be made compact. COPYRIGHT: (C)2011,JPO&INPIT |
