发明名称 |
METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a large-diameter silicon carbide substrate having superior crystallinity. SOLUTION: The method of manufacturing a silicon carbide substrate includes a step of preparing a plurality of SiC substrates 20 consisting of single crystal silicon carbide, a step of arranging a supporting substrate 10 to touch one main surfaces 20C of the plurality of SiC substrates 20 while the plurality of SiC substrates 20 are arranged side by side in plan view, and a step of interconnecting the plurality of SiC substrates 20 by means of the supporting substrate 10. In the step of interconnecting the plurality of SiC substrates 20, a step of heating the supporting substrate 10, and a step of cooling the supporting substrate 10 are carried out repeatedly. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011108721(A) |
申请公布日期 |
2011.06.02 |
申请号 |
JP20090259669 |
申请日期 |
2009.11.13 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
SASAKI MAKOTO;HARADA MAKOTO;NISHIGUCHI TARO;OKITA KYOKO;NAMIKAWA YASUO |
分类号 |
H01L21/02;H01L21/20;H01L21/265;H01L21/336;H01L29/12;H01L29/78 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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