发明名称 METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a large-diameter silicon carbide substrate having superior crystallinity. SOLUTION: The method of manufacturing a silicon carbide substrate includes a step of preparing a plurality of SiC substrates 20 consisting of single crystal silicon carbide, a step of arranging a supporting substrate 10 to touch one main surfaces 20C of the plurality of SiC substrates 20 while the plurality of SiC substrates 20 are arranged side by side in plan view, and a step of interconnecting the plurality of SiC substrates 20 by means of the supporting substrate 10. In the step of interconnecting the plurality of SiC substrates 20, a step of heating the supporting substrate 10, and a step of cooling the supporting substrate 10 are carried out repeatedly. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011108721(A) 申请公布日期 2011.06.02
申请号 JP20090259669 申请日期 2009.11.13
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SASAKI MAKOTO;HARADA MAKOTO;NISHIGUCHI TARO;OKITA KYOKO;NAMIKAWA YASUO
分类号 H01L21/02;H01L21/20;H01L21/265;H01L21/336;H01L29/12;H01L29/78 主分类号 H01L21/02
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