| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder from leaking from a through hole for heat dissipation. SOLUTION: A method of bonding an electronic component 12 with an electrode 12a for heat dissipation to a printed wiring board 14 where the through hole 16 for heat dissipation is formed includes the processes of: applying cream solder to a through-hole outer region excluding the through hole for heat dissipation and its periphery, the printed wiring board including a pad 14a for heat dissipation on its first surface 14c, and the through hole for heat dissipation being formed, as a hole portion penetrating the printed wiring board, from an upper surface of the pad for heat dissipation to a second surface 14d opposed to the first surface 14c; applying an adhesive 20 for reflow to the through-hole region; and mounting the electronic component on the printed wiring board with the electrode for heat dissipation positioned at the pad for heat dissipation, soldering the electronic component to the printed wiring board by a reflow of the cream solder, and curing the adhesive for reflow. COPYRIGHT: (C)2011,JPO&INPIT
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