| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card that can markedly suppress curved deformation of a substrate caused by heat, and can be manufactured at a low cost without using special materials. SOLUTION: The probe card 10 includes a circuit substrate 12 connected in an freely electrical continuity manner to a probe 11A which comes into electrical contact with a wafer W. The circuit substrate 12 includes a base material layer 12A, and surface layers 12B, 12C piled up on both surfaces of the base material layer 12A. The surface layers 12B, 12C have a larger thermal expansion ratio than that of the base material layer 12A, and grooves 12F which divide the surface layer 12B at lower side into a plurality of portions are provided on the surface layer 12B. COPYRIGHT: (C)2011,JPO&INPIT
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