| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide precursor suitable for use as a constituent material for a semiconductor device and the like, especially for use in portions that require dimensional stability, adhesion and heat resistance, and to provide a resin composition of the polyimide precursor. SOLUTION: The polyimide precursor includes at least a repeating unit represented by the general formula (wherein R<SP>1</SP>indicates a tetravalent aromatic ring or aromatic heterocyclic ring group having 6-30 carbon atoms; X indicates a hydrogen atom or a monovalent organic group having 1-30 carbon atoms; and R<SP>2</SP>indicates a divalent aromatic ring group having a benzoxazole structure) and a repeating unit represented by the general formula, wherein R<SP>1</SP>indicates a divalent organic group having a siloxane structure. The polyimide precursor has specific values of a molar ratio between the two repeating units and a reduced viscosity. COPYRIGHT: (C)2011,JPO&INPIT
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