摘要 |
An organic light emitting diode (OLED) display device, including: a base substrate, on which OLEDs are formed; and an encapsulation substrate disposed on the base substrate, to cover the OLEDs; and a bonding member connecting the base substrate and the encapsulating substrate. The base substrate and/or the encapsulation substrate include bonding grooves, in which the bonding member is disposed.
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