| 摘要 |
PURPOSE: An automatic packaging apparatus for a light emitting diode module is provided to effectively protect the surface of a substrate by minimizing the generation of defects in a resin applying process. CONSTITUTION: A plurality of light emitting diode modules is serially arranged on a worktable(110). A guiding rail(120) is arranged on the upper side of the worktable according to the arrangement of the light emitting diode modules. A horizontal moving part(130) moves along the guiding rail. A base(150) vertically moves with respect to the horizontal moving part. A screw mounting part mounts conductive screws by passing through the substrates of the light emitting diode modules. A protecting resin is applied on the surface of the substrates by a resin applying part.
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