发明名称 FILM FORMING APPARATUS
摘要 There is provided film deposition units 54 each including two electrodes, each film deposition unit 54 being configured to generate a plasma between the two electrodes to cover substrates 90 with DLC films, a chamber 12 in which the plural film deposition units 54 are arranged, and a pulsed power supply 60 including electric circuits 62 that are arranged for the respective film deposition units 54, the electric circuits 62 applying a DC pulse voltage between a support electrode 51 and a counter electrode 52 of each of the film deposition units 54.
申请公布号 EP2327811(A1) 申请公布日期 2011.06.01
申请号 EP20090815935 申请日期 2009.02.25
申请人 JP 发明人 JP;JP
分类号 C23C16/54;C23C16/26;C23C16/50;C23C16/515 主分类号 C23C16/54
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