发明名称 |
PCB AND FABRICATING METHOD OF THE SAME |
摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the reliability of a pattern by burying a circuit pattern in an insulation member. CONSTITUTION: A first circuit pattern is formed by processing a base substrate with an insulation layer and a metal conductive layer which are laminated on both sides of a separating member. The insulation layer with a first circuit pattern is separated based on the separating member. The first circuit pattern is buried in the second insulation layer. Metal materials are filled by forming a circuit pattern area by processing a second insulation layer.
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申请公布号 |
KR20110057800(A) |
申请公布日期 |
2011.06.01 |
申请号 |
KR20090114358 |
申请日期 |
2009.11.25 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
NAM, MYOUNG HWA;LEE, SANG MYUNG;AHN, CHI HEE;SEO, YEONG UK;YOON, SUNG WOON;KIM, JIN SU |
分类号 |
H05K3/12;H05K3/06;H05K3/18 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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