发明名称 PCB AND FABRICATING METHOD OF THE SAME
摘要 PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the reliability of a pattern by burying a circuit pattern in an insulation member. CONSTITUTION: A first circuit pattern is formed by processing a base substrate with an insulation layer and a metal conductive layer which are laminated on both sides of a separating member. The insulation layer with a first circuit pattern is separated based on the separating member. The first circuit pattern is buried in the second insulation layer. Metal materials are filled by forming a circuit pattern area by processing a second insulation layer.
申请公布号 KR20110057800(A) 申请公布日期 2011.06.01
申请号 KR20090114358 申请日期 2009.11.25
申请人 LG INNOTEK CO., LTD. 发明人 NAM, MYOUNG HWA;LEE, SANG MYUNG;AHN, CHI HEE;SEO, YEONG UK;YOON, SUNG WOON;KIM, JIN SU
分类号 H05K3/12;H05K3/06;H05K3/18 主分类号 H05K3/12
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