METHOD FOR MANUFACTURING IC CARD

摘要

PURPOSE: An IC card manufacturing method is provided to minimize the pressure and heat of a component by using a semiconductor-curing type epoxy. CONSTITUTION: One of release films attached to the upper side and lower side of a non-stage polymer is removed. A release film is attached on a bottom and top sheet. A circuit board(510) in which an IC chip and a sensor are installed is mounted in the upper side of a stage resin.