发明名称 |
Verwendung von bei niedrigen Temperaturen schäumbaren Epoxidharzen in Hohlraumstrukturen |
摘要 |
<p>A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO2 bound as carbamate.</p> |
申请公布号 |
DE102009029030(A8) |
申请公布日期 |
2011.06.01 |
申请号 |
DE20091029030 |
申请日期 |
2009.08.31 |
申请人 |
HENKEL AG & CO. KGAA |
发明人 |
BARRIAU, EMILIE;BANKMANN, DENNIS;LAMMERSCHOP, OLAF;RENKEL, MARTIN;WUCHERPFENNIG, SVEN;BRAUN, KARL |
分类号 |
C08L63/00;B29C44/12;B29C44/18;C08J9/00;C08K5/205 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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