发明名称 Verwendung von bei niedrigen Temperaturen schäumbaren Epoxidharzen in Hohlraumstrukturen
摘要 <p>A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO2 bound as carbamate.</p>
申请公布号 DE102009029030(A8) 申请公布日期 2011.06.01
申请号 DE20091029030 申请日期 2009.08.31
申请人 HENKEL AG & CO. KGAA 发明人 BARRIAU, EMILIE;BANKMANN, DENNIS;LAMMERSCHOP, OLAF;RENKEL, MARTIN;WUCHERPFENNIG, SVEN;BRAUN, KARL
分类号 C08L63/00;B29C44/12;B29C44/18;C08J9/00;C08K5/205 主分类号 C08L63/00
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